Abstract:Timely repair of fused silica damage ensures the stable operation of high-power laser systems. In the traditional repair process, the material nearby the damaged area is gradually ablated with CO2 or femtosecond laser. Subsequently, homogenization and residual stress removal are required because of the microcracks and thermal accumulation generated with the ablation. As a result, the repair efficiency is greatly restricted. In this paper, a new method using in-volume, selective femtosecond laser-induced etching to repair the damage of fused silica is proposed. The region irradiated by femtosecond laser becomes more susceptible to the etching solution due to its constitutive characteristics having undergone chemical restructuring. In this way, material nearby the damaged area transparent to the laser radiation is modified locally inside the volume. A femtosecond laser is used to scan the damaged area with a 3D hollow trajectory. The applicable modification of fused silica occurs when the single pulse energy is approximately 2 μJ to 5 μJ, the repetition frequency is approximately 200 kHz to 500 kHz, and the scanning speed is approximately 10 mm/s. Then, the etching solution reacts quickly along the 3D profile of the modified path, and the damaged area is removed as a whole piece. This method can greatly reduce the workload of repair, and the etching process of fused silica is carried out synchronously. So, the etching efficiency is not affected by the number of damage points. In addition, the weak reaction between the etching solution and the substrate could homogenize the interface. It provides an efficient way to repair the surface damage of fused silica.

Optimum Inductively Coupled Plasma Etching of Fused Silica to Remove Subsurface Damage Layer

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Isotropic Etch for SiO2 Microcantilever Release with ICP System

Combination of scanning ion beam etching and dynamic chemical etching for improving laser damage resistance of fused silica optics

Effect of ion beam etching on surface/subsurface structural defect evolution in fused silica optics

Etching Quartz with Inductively Coupled Plasma Etching Equipment

Repair of Fused Silica Damage Using Selective Femtosecond Laser-Induced Etching

Advanced Mitigation Process (AMP) for Improving Laser Damage Threshold of Fused Silica Optics

Sub-damage-threshold plasma etching and profile tailoring of Si through laser-stimulated thermal desorption

Study on the Absorption Characteristics and Laser Damage Properties of Fused Silica Optics under Flexible Polishing and Shallow DCE Process

Evolution of physical and mechanical properties of fused silica after subsurface damage layer removal by RIE treatment

Remote Plasma Enhanced Cyclic Etching of a Cyclosiloxane Polymer Thin Film

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

NOVEL ETCHING TECHNOLOGY OF INP BY INDUCTIVELY COUPLED PLASMA1

Inductively Coupled Plasma etching of amorphous silicon nanostructures over nanotopography using C4F8/SF6 chemistry

KOH-based shallow etching for exposing subsurface damage and increasing laser damage resistance of fused silica optical surface

Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC

Experimental Study on Evolution of Chemical Structure Defects and Secondary Contaminative Deposition during HF-Based Etching

Research on Laser-Induced Damage Post-Restoration Morphology of Fused Silica and Optimization of Patterned CO2 Laser Repair Strategy

Dual-control of incubation effect for efficiently fabricating surface structures in fused silica

Vertical and Smooth, Etching of Inp by Cl-2/Ch4/Ar Inductively Coupled Plasma at Room Temperature