Abstract:SiC/SiC composites have a promising application prospect in the fields of aero-engine turbine blades and other hot-end components due to their excellent properties. It is difficult to machine SiC/SiC composites by traditional mechanical processing because of the ultra-high hardness and anisotropic character. The routinely laser direct processing in the air produce thermal effect damage, resulting in heat-affected zones and microcracks. Here high-temperature chemical-assisted nanosecond laser processing was investigated to realize one-step in-situ fast etching without causing damage to the structure of SiC/SiC composites. Firstly, the chemical wet etching only occurred in the laser-induced local high-temperature region. There was no additional etching damage to the substrate material in the region where the temperature was relatively low. Secondly, chemical liquid served as a transparent constraint layer, the ablation pressure on the material increased in a liquid confined environment. In comparison with laser direct etching in the air, the exposed fiber was not a needle-like structure and tubular structure but turned into a thin and flat tongue-like structure. The etching behavior of 0° fiber layer, 90° fiber layer, and crossing regions of fibers of different directions at low and high laser intensities were studied. Further, the hardness and friction coefficient of SiC/SiC composites after laser direct etching in the air and high-temperature chemical-assisted laser etching were compared. The chemical elementary composition before and after etching was measured to reveal the oxidized and carbonized characteristics. It was concluded that the action mechanism was the combined result of high-temperature decomposition, laser-induced ablation pressure in the liquid confined region, and local chemical wet etching. The results demonstrate that high-temperature chemical-assisted laser etching has some advantages over traditional laser beam machining and is a potential processing method for SiC/SiC composites.

Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC

Investigation on ultrasonic vibration-assisted femtosecond laser polishing of C/SiC composites

High speed and low roughness micromachining of silicon carbide by plasma etching aided femtosecond laser processing

One-step in-situ low damage etching of SiC/SiC composites by high-temperature chemical-assisted laser processing

An experimental investigation of scan trajectory into the underwater femtosecond laser polishing SiC ceramic

Removal mechanism of SiC/SiC composites by underwater femtosecond laser ablation

Investigation on the underwater femtosecond laser polishing SiC ceramic

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Investigations on the oxidation behavior and removal mechanism of SiC/SiC composites by multi-pulse femtosecond laser ablation

Femtosecond Laser Spiral Scanning Ablation of SiCf/SiC Composites

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Investigation of mechanism and surface morphology on the femtosecond laser ablation of silicon nitride under different auxiliary processing environments

Mechanism and morphology control of underwater femtosecond laser microgrooving of silicon carbide ceramics.

Investigations on the ablation behavior of C/SiC under femtosecond laser

A Comparison among Dry Laser Ablation and Some Different Water-Laser Co-Machining Processes of Single Crystal Silicon Carbide

Nanosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP) Process for Promoting Material Removal of Single Crystal 4H-Sic

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiCf/SiC composites

Waterjet-guided Laser Processing of SiC/SiC Ceramic Matrix Composites to Obtain High Cleanliness and Low Oxidation Damage Characteristics Surfaces

Water jet guided laser grooving of SiC f /SiC ceramic matrix composites

Stealth Dicing of SiC Using Femtosecond Laser Bessel Beam

Microstructure evolution and ablation mechanism of SiCf/SiC ceramic matrix composite microgrooves processed by pico-second laser