Abstract:<p>HF-based wet deep etching is an effective method for improving the laser damage resistance of fused silica optics. However, the fact that the etching process involves HF reaction makes the operation very unsafe. Potassium hydroxide (KOH) has recently shown great potential to outperform the more commonly used HF-acid as an etchant for the damage resistance enhancement of fused silica optical surface. In this paper, we present a detailed investigation into how the KOH-based shallow etching process affects the polished surface of fused silica. The results show that KOH-based etching does a good job at exposing the subsurface damage and increasing the laser damage threshold of fused silica while keeping the surface roughness nearly unchanged. Potential factors that limit the further increase in surface damage threshold of fused silica are also delved. The study offers an exciting option for fabricating high-quality fused silica optics with shallow wet etching under higher safety conditions that cannot be achieved with conventional HF-based wet etching approaches.</p>

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to find a safer and more effective alternative method to replace the traditional hydrofluoric acid (HF) deep - etching technique while increasing the laser - induced damage threshold (LIDT) of fused silica optical surfaces. Specifically, the researchers explored the use of potassium hydroxide (KOH) - based shallow - etching techniques to treat fused silica optical surfaces, in order to expose subsurface damage and increase its laser - damage resistance, while keeping the surface roughness almost unchanged. This method aims to overcome the safety problems and environmental impacts existing in the HF - etching process and provide a new way to manufacture high - quality fused silica optical components under higher safety conditions. The key points mentioned in the paper include: - **Problem Background**: Fused silica is widely used in various laser systems because of its high optical transparency, compressive strength and low thermal expansion coefficient. However, its surface damage may limit its optical performance and service life, especially in high - flux laser systems such as inertial confinement fusion (ICF). Sub - surface damage (SSD) generated during grinding and polishing can act as a precursor, leading to surface damage under ultraviolet and nanosecond - level laser irradiation. - **Existing Solutions and Their Limitations**: Although methods such as plasma/ion - beam etching and magnetorheological polishing can improve the laser - induced damage threshold (LIDT) of fused silica to a certain extent, the effects of these methods are limited. The introduction of the advanced mitigation process (AMP) concept, which is processed under multi - frequency ultrasonic or mega - sonic agitation through optimized HF acid etching or buffered oxide etching (BOE), has significantly improved the surface LIDT. However, the hexafluorosilicate (SiF6^2 - ) generated during the HF - acid - etching process may absorb ultraviolet laser energy and cause damage, and deep etching (> 20 μm) is required, which will lead to a decline in the quality of the fused silica optical surface. Moreover, HF acid is highly corrosive and irritating, bringing a huge burden on the environment and economic efficiency. - **Proposed Method**: The researchers proposed using a KOH - based shallow - etching technique (2 - 3 μm) to treat fused silica optical surfaces in order to expose subsurface damage and improve the laser - damage threshold. The experimental results show that KOH - based etching can not only effectively expose subsurface damage, but also significantly improve the laser - damage threshold while keeping the surface roughness almost unchanged. In addition, adding an appropriate amount of potassium fluoride (KF) can further optimize the etching rate and control effect, reduce the surface defect density, and improve the laser - damage threshold. In conclusion, this paper aims to provide a safer and more efficient alternative solution through the KOH - based shallow - etching technique to improve the laser - damage threshold and surface quality of fused silica optical components.

KOH-based shallow etching for exposing subsurface damage and increasing laser damage resistance of fused silica optical surface

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