Abstract:Single crystal silicon is a chemically active semiconductor material with good processing characteristics. With the development of technology, the role of single crystal silicon components in the field of ICF is becoming more and more important. Restricted by traditional processing method and MRF, damage precursors such as scratches and impurities still remain on the surface after processing. That may influence the performance of the elements. In this paper, we study the effect on the surface by two chemical etching methods and the influence on the damage precursors of nano jet polishing. We used HF solution/HNO3 and KOH/ isopropanol to etch the surface of the element. When the etching depth comes to 0.2 μm, pits and scratches could be easily found on the surface. After the etching process, the element was processed by nano jet polishing and the roughness decreased from 1.264nm to 0.986nm.We used nano jet polishing method to process the element polished by MRF in order to research the evolution of comet-tail scratch. The In-situ tracking method was also applied in this study. After the polishing process, the W-D (width to depth ratio) increased from 30.51 to 45.84. The scratch was deactivated and the PTA (photothermal absorption) decreased from 1.5413nA to 1.3500nA. The Ce impurities were also removed. Its concentration decreased from 0.1162mg/L to 0.0005mg/L and the PTA of the element decreased from 0.3044nA to 0.0652nA. From the research, we can easily know that the subsurface damage exposed after the etching process. That may lay the foundation of the nondestructive processing of single crystal silicon. After nano jet polishing process, the quality of the element became better. The roughness and concentration of Ce impurities decreased. The damage precursors were deactivated and the PTA decreased. In a word, chemical etching could expose the surface damage of single crystal silicon and nano jet polishing can improve the laser damage resistance.

The influence of chemical etching on the surface quality of phase components

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Combined Etching Technology for Controlling Surface Damage Precursors to Improve Laser Damage Resistance of Fused Silica

A two-step physical-chemical etching technique to improve laser damage resistance of fused silica

Improving Uv Laser Damage Threshold Of Fused Silica Optics By Wet Chemical Etching Technique

Improvement of laser damage thresholds of fused silica by ultrasonic-assisted hydrofluoric acid etching

Improve the Laser Damage Resistance of Fused Silica by Wet Surface Cleaning and Optimized HF Etch Process

The Influence of Etching Depth on Surface Molecular Structures and Laser Damage Thresholds of Fused Silica by using Megasonic-assisted HF-based Etching

Advanced Mitigation Process (AMP) for Improving Laser Damage Threshold of Fused Silica Optics

Effect of Polishing-Induced Subsurface Impurity Defects on Laser Damage Resistance of Fused Silica Optics and Their Removal with Hf Acid Etching

Study on the Absorption Characteristics and Laser Damage Properties of Fused Silica Optics under Flexible Polishing and Shallow DCE Process

Laser Induced Damage Characteristics of Fused Silica Optics Treated by Wet Chemical Processes

Effect of Different Etching Processes on Surface Defects of Quartz Crystals

Investigation of Grinding and Lapping Surface Damage Evolution of Fused Silica by Inductively Coupled Plasma Etching

Investigation of surface damage precursor evolutions and laser-induced damage threshold improvement mechanism during Ion beam etching of fused silica.

Experimental study on HF etching of fused silica

Detailed Near-Surface Nanoscale Damage Precursor Measurement and Characterization of Fused Silica Optics Assisted by Ion Beam Etching

Evolution of physical and mechanical properties of fused silica after subsurface damage layer removal by RIE treatment

Review on Wet Etching Technique of Fused Silica Optical Elements

Effects of Acid-Etching Depth on 355 Nm Laser-Induced Damage Threshold of Fused Silica

Single Crystal Silicon: Surface Evolution Regularity of Chemical Etching and Effect of Nano Jet Polishing on Damage Precursor