Femtosecond laser modification combined with chemical etching to achieve high-quality cutting of millimeter-thick fused silica

Youwang Hu,Yalong Wang,Xianshan Dong,Xiang Xi,Chao Long,Haoning Zheng,Yao Wang,Xiaoyan Sun,Ji’an Duan
DOI: https://doi.org/10.1016/j.ijleo.2022.169861
IF: 3.1
2022-08-29
Optik
Abstract:With the development of technology, fused silica has been widely used in many industrial fields because of its good physical and chemical properties. Especially in the processing and manufacturing of MEMS devices, fused silica has a great application prospect. The actual project puts forward higher requirements for the cutting of fused silica: it can not only ensure the cutting quality, but also be suitable for sample cutting in a wide range of thickness. In order to meet the processing requirements, this paper uses the method of combining femtosecond laser modification processing and chemical etching technology to cut fused silica. The processing parameters of femtosecond laser for modification of fused silica, such as feeding method, laser pulse energy, scanning speed and single feed amount, are mainly explored. The modified sample is etched with 5% HF solution assisted by ultrasonic wave, and the high-quality cutting of millimeter-thick fused silica is realized, with the steepness of more than 89°, the edge collapse size of less than 2 μm and the cross-section roughness of less than 0.5 μm. This method can be applied to the field of precision machining of femtosecond laser.
optics
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