Abstract:Timely repair of fused silica damage ensures the stable operation of high-power laser systems. In the traditional repair process, the material nearby the damaged area is gradually ablated with CO2 or femtosecond laser. Subsequently, homogenization and residual stress removal are required because of the microcracks and thermal accumulation generated with the ablation. As a result, the repair efficiency is greatly restricted. In this paper, a new method using in-volume, selective femtosecond laser-induced etching to repair the damage of fused silica is proposed. The region irradiated by femtosecond laser becomes more susceptible to the etching solution due to its constitutive characteristics having undergone chemical restructuring. In this way, material nearby the damaged area transparent to the laser radiation is modified locally inside the volume. A femtosecond laser is used to scan the damaged area with a 3D hollow trajectory. The applicable modification of fused silica occurs when the single pulse energy is approximately 2 μJ to 5 μJ, the repetition frequency is approximately 200 kHz to 500 kHz, and the scanning speed is approximately 10 mm/s. Then, the etching solution reacts quickly along the 3D profile of the modified path, and the damaged area is removed as a whole piece. This method can greatly reduce the workload of repair, and the etching process of fused silica is carried out synchronously. So, the etching efficiency is not affected by the number of damage points. In addition, the weak reaction between the etching solution and the substrate could homogenize the interface. It provides an efficient way to repair the surface damage of fused silica.

Nanochannels in Fused Silica through NaOH Etching Assisted by Femtosecond Laser Irradiation

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Femtosecond Laser Nanomachining of High‐Aspect‐Ratio Channels in Bulk Fused Silica (Adv. Mater. Technol. 18/2024)

Repair of Fused Silica Damage Using Selective Femtosecond Laser-Induced Etching

Liquid-Assisted Femtosecond Laser Precision-Machining of Silica.

Polarization-insensitive space-selective etching in fused silica induced by picosecond laser irradiation

Investigation on Femtosecond Laser-Assisted Microfabrication in Silica Glasses

A two-step physical-chemical etching technique to improve laser damage resistance of fused silica

Femtosecond laser modification combined with chemical etching to achieve high-quality cutting of millimeter-thick fused silica

Experimental study on direct fabrication of micro channel on fused silica by picosecond laser

Effects of Thermal Annealing on Femtosecond Laser Micromachined Glass Surfaces

Anisotropic Ion Beam Etching Of Fused Silica To Mitigate Subsurface Damage

Direct Fabrication of Homogeneous Microfluidic Channels Embedded in Fused Silica Using a Femtosecond Laser

Improve the Laser Damage Resistance of Fused Silica by Wet Surface Cleaning and Optimized HF Etch Process

Experimental Investigation on Processing of Fused Silica Microchannels by High Repetition Rate Femtosecond Laser

Recovery of fused silica surface damage resistance by ion beam etching

Fabrication of fluidic submicron-channels by pulsed laser-induced buckling of SiOx films on fused silica

Bessel Beam Femtosecond Laser Interaction with Fused Silica Before and After Chemical Etching: Comparison of Single Pulse, MHz-Burst, and GHz-Burst

Experimental study on HF etching of fused silica

Subwavelength structures for high power laser antireflection application on fused silica by one-step reactive ion etching

Nanochannels with a 18-Nm Feature Size and Ultrahigh Aspect Ratio on Silica Through Surface Assisting Material Ejection