Abstract:W-30Cu/xTiC (x=0∼4, wt%) composite powders were prepared by electroless plating with simplified pretreatment. The composite powders were formed by cold compaction under 400 MPa using a tablet machine and green compactions were sintered at 1300 °C for 1 h. Micromorphology of the original W and TiC powders, simple-treated W and TiC powders, and as-received W-30Cu/xTiC (x=0∼4) composite powders after electroless plating were characterized by field emission scanning electron microscopy (FE-SEM). Microstructures of the W-30Cu/xTiC (x=0∼4) composites were also investigated by FE-SEM. The effect of TiC content on the properties of W-30Cu/xTiC (x=0∼4) composites (such as relative density, hardness, electrical conductivity, and compressive strength) were studied. Results show that W-30Cu/TiC composite powders with uniform structure are obtained by simplified W and TiC powder pretreatment, followed by electroless copper plating. When TiC content is less than 1 wt%, the compressive strength and hardness of composite materials obviously increase and the electrical conductivity of composite materials decreases with TiC content increasing. However, the electrical conductivity of composite materials is still higher than that of the national standard value. With a certain amount of TiC content to W-30Cu/xTiC (x=0∼4) composites, the composites exhibit good comprehensive performance.

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