Breakdown Voltage of Ultrathin Dielectric Film Subject to Electrostatic Discharge Stress

Hao Jin,Shurong Dong,Meng Miao,Juin Jei Liou,Cary Y. Yang
DOI: https://doi.org/10.1063/1.3633527
IF: 2.877
2011-01-01
Journal of Applied Physics
Abstract:Ultrathin silicon oxide film for nano-electromechanical system (NEMS) applications is investigated under electrostatic discharge (ESD) stress using a transmission line pulse (TLP) tester. The measured breakdown voltage and transient response are analyzed. The results show that the voltage stress time has a significant effect on the breakdown voltage. By shortening the stress time, the breakdown voltage increases by 2–3 times. With the area shrinking breakdown voltage increases, and there is a critical value, below which the breakdown voltage increases dramatically with decreasing area. It is possible to enhance the ESD robustness by using a multiple small-area dielectric layer structure. Shorten ESD pulse rise-time induces a higher overshoot current and then accelerates oxide failure, resulting in a lower breakdown voltage for a faster pulse.
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