A Selective Area Metal Bonding Method for Si Photonics Light Sources

Tao Hong,Yang Wang,Hong-Yan Yu,Song Yue,Wei-Xi Chen,Song Liang,Zhi Li,Jiao-Qing Pan,Guang-Zhao Ran
DOI: https://doi.org/10.1109/group4.2010.5643442
2010-01-01
Abstract:A 1.55 μm hybrid InGaAsP-Si laser was fabricated by the selective area metal bonding method. Room temperature continuous lasing with a maximum output power of 0.45 mW is realized.
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