Fabrication of InAsP/InGaAsP Quantum-Well 1.3μm VCSELs by Direct Wafer-Bonding

Yanfeng Lao,Chunfang Cao,Huizhen Wu,Meng Cao,Cheng Liu,Zhengsheng Xie,Qian Gong
DOI: https://doi.org/10.3321/j.issn:0253-4177.2008.11.038
2008-01-01
Abstract:We designed and fabricated a vertical-cavity surface-emitting laser (VCSEL) that consisted of an InP-based active layer with InAsP/InGaAsP strain-compensated multi-quantum wells, SiO2/TiO2 dielectric film, and GaAs/AlAs semiconductor distributed Bragg reflectors (DBRs). The InP-based active layers and GaAs-based DBRs were integrated using wafer-direct bonding techniques. Then, devices were successfully fabricated upon related device processing such as current-aperture definition using wet-etching undercut techniques and deposition of dielectric DBR, etc. The threshold current of the VCSEL is 13.5mA and the wavelength of the single mode is 1288.6nm. ©2008 Chinese Institute of Electronics.
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