1.9 μm hybrid silicon/iii-v semiconductor laser

po dong,t c hu,leiqi zhang,m dinu,r f kopf,atsushi tate,l l buhl,d t neilson,xiaohua luo,tsungyang liow,guoqiang lo,yenkuang chen
DOI: https://doi.org/10.1049/el.2013.0674
2013-01-01
Electronics Letters
Abstract:A 1.9 μm hybrid silicon/III-V laser based on a wafer bonding technique is reported. The gain materials are InGaAs multiple quantum wells grown on InP substrate, with strain compensation between barriers and wells. The III-V wafer is bonded to a silicon-on-insulator wafer with processed silicon waveguides and transition tapers. Laser emission with a threshold current of 95 mA at room temperature and 45 mA at 5 °C is demonstrated.
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