Effect of Annealing Conditions on Residual Stress in Sol-Gel-derived Pb(Zr0.52Ti0.48)O3 Film

YANG Fan,FEI Wei-dong,LI Wei-li,GAO Zhong-min,JIANG Jian-qing
DOI: https://doi.org/10.3321/j.issn:1001-9731.2007.08.013
2007-01-01
Journal of Functional Biomaterials
Abstract:Pb(Zr0.52Ti0.48)O3 ferroelectric thin films were prepared by a modified sol-gel process.The microstructures and compositions of the film were analyzed by atomic force microscopy and X-ray diffraction and two-dimensional diffraction technique,respectively.The residual stresses of the PZT films were measured by grazing incidence X-ray diffraction.The PZT films were smooth with low roughness,and were well crystallized by annealing at 600℃ for 30min.The XRD results showed that sol-gel PZT films were in tension;and the residual stresses in PZT film increased with growing annealing temperature and annealing interval;and that with the increasing of film thickness, the residual stress firstly increased and then decreased in thicker film.
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