Nanostructuring of Si(100) by Normal-Incident Ar+ Ion Sputtering at Low Ion Flux

LJ Qi,WQ Li,XJ Yang,YC Fang,M Lu
DOI: https://doi.org/10.1088/0256-307x/22/2/045
2005-01-01
Abstract:We investigate Si(100) surface morphology evolution under normal-incident Ar+ ions sputtering with low ion flux of 20muA/cm(2). The results indicate that under the low flux ion sputtering, the nanostructuring process of Si(100) is governed by the Ehrlich-Schwoebel (ES) mechanism, rather than by the Bradley-Harper (BH) one for the case of high flux (normally the order of 10(2) muA/cm(2) or larger). This work reveals that the ion flux plays an important role in the surface morphology evolution under ion sputtering, and a usually accepted classification that the ES mechanism is related to metal single-crystals under ion sputtering, while the BH one is to amorphous, and semiconductor targets is questionable.
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