Bipolar One Diode–one Resistor Integration for High-Density Resistive Memory Applications

Yingtao Li,Hangbing Lv,Qi Liu,Shibing Long,Ming Wang,Hongwei Xie,Kangwei Zhang,Zongliang Huo,Ming Liu
DOI: https://doi.org/10.1039/c3nr33370a
IF: 6.7
2013-01-01
Nanoscale
Abstract:Different from conventional unipolar-type 1D-1R RRAM devices, a bipolar-type 1D-1R memory device concept is proposed and successfully demonstrated by the integration of Ni/TiOx/Ti diode and Pt/HfO2/Cu bipolar RRAM cell to suppress the undesired sneak current in a cross-point array. The bipolar 1D-1R memory device not only achieves self-compliance resistive switching characteristics by the reverse bias current of the Ni/TiOx/Ti diode, but also exhibits excellent bipolar resistive switching characteristics such as uniform switching, satisfactory data retention, and excellent scalability, which give it high potentiality for high-density integrated nonvolatile memory applications.
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