Effects of bismuth doping on the thermoelectric properties of Cu 3SbSe4 at moderate temperatures

Xiaoyü Li,Desong Li,Hongxing Xin,Jinlong Zhang,Chi Song,Xiaoying Qin
DOI: https://doi.org/10.1016/j.jallcom.2013.01.131
IF: 6.2
2013-01-01
Journal of Alloys and Compounds
Abstract:The thermoelectric properties of the bismuth doped compounds Cu 3Sb1-xBixSe4, prepared by melting method and spark plasma sintering (SPS) technique, were investigated in the temperature range from 300 K to 600 K. The results indicate that the electrical resistivity of the Bi-doped compounds decreased as compare to Cu 3SbSe4 due to the increase in the hole concentration; also thermal conductivity lowered after doping, which can be attributed to the strong phonons scattering by atom mass fluctuations. Moreover, it is found that the state of density effective mass m* increases for the doped compounds, which could be responsible for the enhanced thermopower at T > ̃400 K. The largest ZTmax = 0.7 is achieved at 600 K for Cu 3Sb0.98Se0.02, which is about 3.3 times larger than that of the un-doped compounds. © 2013 Elsevier B.V. All rights reserved.
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