Bonding Tungsten, W–Cu-alloy and Copper with Amorphous Fe–W Alloy Transition

Song Wang,Yunhan Ling,Pei Zhao,Nanzhi Zang,Jianjun Wang,Shibin Guo,Jun Zhang,Guiying Xu

DOI: https://doi.org/10.1016/j.fusengdes.2013.02.167

IF: 1.905

2013-01-01

Fusion Engineering and Design

Abstract:W/Cu graded materials are the leading candidate materials used as the plasma facing components in a fusion reactor. However, tungsten and copper can hardly be jointed together due to their great differences in physical properties such as coefficient of thermal expansion and melting point, and the lack of solid solubility between them. To overcome those difficulties, a new amorphous Fe–W alloy transitional coating and vacuum hot pressing (VHP) method were proposed and introduced in this paper. The morphology, composition and structure of the amorphous Fe–W alloy coating and the sintering interface of the specimens were analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The thermal shock resistance of the bonded composite was also tested. The results demonstrated that amorphous structure underwent change from amorphous to nano grains during joining process, and the joined W/Cu composite can endued plasma thermal shock resistance with energy density more than 5.33MW/m2. It provides a new feasible technical to join refractory tungsten to immiscible copper with amorphous Fe–W alloy coating.