High-strength Diffusion Bonding of Oxide-Dispersion-strengthened Tungsten and CuCrZr Alloy Through Surface Nano-Activation and Cu Plating

Yuanyuan Chen,Yuan Huang,Fei Li,Lu Han,Dongguang Liu,Laima Luo,Zongqing Ma,Yongchang Liu,Zumin Wang
DOI: https://doi.org/10.1016/j.jmst.2021.03.040
2021-01-01
Abstract:Oxide-dispersion-strengthened tungsten (ODS-W) and a CuCrZr alloy were bonded by a three-step process: (i) surface nano-activation, (ii) copper plating followed by annealing, and (iii) diffusion bonding. The morphological and structural evolutions of ODS-W and the interface of the ODS-W/CuCrZr joint during these processes have been thoroughly studied by X-ray diffraction, scanning electron microscopy, energy dispersive spectrometry, and high-resolution transmission electron microscopy. After surface nano-activation, a nanoporous structure of ODS-W with an average pore size of ~100 nm was obtained, and the Y2O3 particles therein remained unchanged. A Cu coating was tightly bonded with the surface nano-activated ODS-W after Cu plating and annealing. An interaction layer embedded with nanosized W particles was formed at the interface between ODS-W and plated Cu after the three-step process. Consequently, well-cohesive ODS-W/Cu and ODS-W/Y2O3/Cu interfaces were formed. The ODS-W/CuCrZr joint showed high shear strengths (up to 201 MPa) and effective bonded area ratios (>98%). The developed three-step bonding process between ODS-W and the CuCrZr alloy provides an effective support for future plasma-facing components in nuclear fusion reactor applications.
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