Characterization of a stoichiometric SiC film deposited on a thermally oxidized Si substrate

J. Yi,X.D. He,Y. Sun
DOI: https://doi.org/10.1016/j.jallcom.2007.07.042
IF: 6.2
2008-01-01
Journal of Alloys and Compounds
Abstract:Though SiC occurred decomposition during electron beam direct evaporation, the stoichiometric and void-free SiC thin film was still grown on thermally oxidized Si substrate through optimizing electron beam-physical vapor deposition (EB-PVD) technology. The image of atomic force microscopy (AFM) shows that the film is dense, homogeneous and void-free. The result of Micro-Raman spectroscopy and Fourier transformed infra-red (FTIR) spectroscopy shows that the film is mainly composed of SiC and a little C. Moreover, X-ray photoelectron spectroscopy (XPS) depth profile analysis was also carried out to investigate the distribution of component across the cross-section of thin film, and the result shows that SiC is stoichiometric.
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