Abstract:Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features size and shape is essential. Here, a versatile fabrication process is presented to achieve tailored silicon nanostructures (thin/thick pillars, sharp/truncated/re-entrant cones), of pitch down to ~50 nm, and high-aspect ratio (>10). The approach relies on pre-assembled block copolymer (BCP) micelles and their direct transfer into a glass hard mask of an arbitrary thickness, now enabled by our recently reported regenerative secondary mask lithography. During this pattern transfer, not only the mask diameter can be decreased but also uniquely increased; constituting the first method to achieve such tunability without necessitating a different molecular weight BCP. Consequently, the hard mask modulation (height, diameter) advances the flexibility in attainable inter-pillar spacing, aspect ratios, and re-entrant profiles (= glass on silicon). Combined with adjusted silicon etch conditions, the morphology of nanopatterns can be highly customized. The process control and scalability enable uniform patterning of a 6-inch wafer which is verified through cross-wafer excellent antireflectivity (<5%) and water-repellency (advancing contact angle 158°; hysteresis 1°). It is envisioned the implementation of this approach to silicon nanostructuring to be far-reaching, facilitating fundamental studies and targeting applications spanning solar panels, antifogging/antibacterial surfaces, sensing, amongst many others.

The Fabrication of High-Aspect-ratio, Size-Tunable Nanopore Arrays by Modified Nanosphere Lithography.

Multiple-Patterning Nanosphere Lithography for Fabricating Periodic Three-Dimensional Hierarchical Nanostructures.

Fabrication of Silicon Nanopore Arrays Using A Combination of Dry and Wet Etching

Massive Fabrication of Silicon Nanopore Arrays with Tunable Shapes

Fabrication of ultrahigh-aspect-ratio and periodic silicon nanopillar arrays using dislocation lithography and deep reactive-ion etching

Controllable Fabrication of Pyramidal Silicon Nanopore Arrays and Nanoslits for Nanostencil Lithography

Wafer-scale Fabrication of High-Aspect Ratio Nanochannels Based on Edge-Lithography Technique.

A novel method to fabricate silicon nanopore arrays

Fabrication of Silicon Nanopore Arrays with Three-Step Wet Etching

Fabrication of large-scale periodic silicon nanopillar arrays for 2D nanomold using modified nanosphere lithography☆

Fabrication of Hourglass-Shaped Solid-State Nanopores

Fabrication Of Inverted-Pyramid Silicon Nanopore Arrays With Three-Step Wet Etching

Control of deposition channels in nanosphere templates for high-density nanodot array production

Fabrication of Nanopore and Nanopore Arrays in Si Substrate by Wet Etching Method at Wafer Scale

A route to engineered high aspect-ratio silicon nanostructures through regenerative secondary mask lithography

Electrochemically Etched Pore Array in Silicon with Large Spacing and High-Aspect-ratio

FABRICATION OF SILICON NANOARRAYS BY DIRECT NANOSPHERE LITHOGRAPHY

Rapid fabrication of solid-state nanopores with high reproducibility over a large area using a helium ion microscope.

Fabrication of Silicon Nanopores with Tunable Shapes and Sizes

New Colloidal Lithographic Nanopatterns Fabricated by Combining Pre-Heating and Reactive Ion Etching

Biochemical and spectroscopic characterization of an aldehyde oxidoreductase isolated from Desulfovibrio aminophilus.