Stacked 3-D Fin-CMOS Technology

XS Wu,PCH Chan,SD Zhang,CG Feng,MS Chan
DOI: https://doi.org/10.1109/led.2005.848070
IF: 4.8157
2005-01-01
IEEE Electron Device Letters
Abstract:A stacked three-dimensional Fin-CMOS (SF-CMOS) technology has been proposed and implemented. The technology is based on a double-layer SOI wafer formed by performing two oxygen implants to form two single-crystal silicon films with isolation layer in between. The proposed approach achieves a 50% area reduction and significant shortening of wiring distance between the active devices when compared with existing planar CMOS technology. The SF-CMOS technology also inherits the scalability and two-dimensional processing compatibility of the FinFET architecture.
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