Stacked SiGe/Si I/O FinFET device preparation in a vertically stacked gate-all-around technology

Fei Zhao,Yan Li,Huaizhi Luo,Xiaofeng Jia,Jiayi Zhang,Xiaotong Mao,Yongliang Li
DOI: https://doi.org/10.1016/j.mssp.2023.107634
IF: 4.1
2023-05-28
Materials Science in Semiconductor Processing
Abstract:In this work, a stacked SiGe/Si input-output (I/O) FinFET device preparation with an optimized thermal budget and atomic layer deposition (ALD) SiO 2 gate dielectric is investigated. First, a vertical and smooth profile of the stacked SiGe/Si fin without obvious Ge diffusion and SiGe oxidation is maintained by developing an optimized STI densification process using rapid thermal annealing (RTA) of 850 °C for 30s. Then, a high-quality ALD SiO 2 with thickness of 3 nm suitable for the gate dielectric layer of I/O device is verified based on MOS capacitance (CAP) structure. Finally, a stacked SiGe/Si I/O FinFET targeting 1.8V operating voltage (V DD ) is successfully prepared with good physical structure and electrical characteristics. Meanwhile, its maximum operating voltage (V max ) for a 10 years lifetime at a failure rate of 0.01% can reach to 2.03V. Therefore, these newly developed processes are practical for the stacked SiGe/Si I/O FinFET device in a vertically stacked GAA technology.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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