Abstract:Stress generated during thin film deposition is a critical issue for many applications. In general, the possible origins of the residual stress include intrinsic and extrinsic stresses. Since high residual stresses can cause detrimental effects on the film, such as delamination and wrinkle, it is of great importance to quantify the residual stress for the optimal design and the evaluation of its mechanical behavior. In this study, a method combining focused ion beam (FIB) milling and geometric phase analysis (GPA) is developed to assess the residual stress of thin films. The procedures of the residual stress measurement using this method include grating fabrication and slot milling by FIB, high-resolution scanning electron microscope (SEM) imaging of the grating before and after stress relaxation, and deformation analysis by GPA. The residual stress can be inferred from the released deformation using the reference displacements of the finite element model. As an application, this method was utilized to measure the residual stress in a TiAlSiN film, and the measured result is in good agreement with that obtained by the curvature method. In order to analyze the measurement error, the influence factors of Ga+ bombardment and the deposited platinum layer on the stress calculation are also discussed in detail.

Measuring the Axial Stress in Elliptic Aluminum Film Using Interference Method

Method to Analyze and Evaluate the Depth Profile of the Three Dimensional Residual Stresses State with X-ray

Study on Measurement Method of Interior Stress Distributions in Engineering Rolled-Plates

A METHOD FOR BIAXIAL F CTU ST' SS TEST OF NANOSCALE FILM

A Method for Biaxial Fracture Stress Test of Nanoscale Film

A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry

Evaluation of Multiaxial Stress in Textured Cubic Films by X-Ray Diffraction

An Alternative Micro-Area X-Ray Diffraction Method for Residual Stress Measurement of Pb(Zr,Ti)O-3 Film

Residual Stress Measurement in Thin Films Using a Slitting Method with Geometric Phase Analysis under a Dual Beam (FIB/SEM) System

Extension of the Stoney formula for the incremental stress of thin films

A Method of Studying the Effect of Stress and Thermal-stress Coupling on the Thermal Conductivity of the Film

Measurement of residual stress in micro-end-milling of AMS 5833 Co-Cr-Ni alloy thin film

Analyses of interfacial stresses and normal stresses within an elongated film strip/substrate system

Externally Applied Stress Sign and Film Elastic Properties Effects on Brittle Film Fracture

Eddy Current Testing of Residual Stress State in Aluminum Alloy

MEASUREMENT AND REPRESENTATION OF THE INTER-PHASE STRESS FOR DOUBLE-PHASE MATERIAL BY X-RAY METHOD

Residual Stress of Individual Aluminum Grains from Three Dimensional X-Ray Diffraction

X-Ray Residual Stress Measurement in Films with Crystallographic Texture and Grain Shape

A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films

Measuring stiffness and residual stress of thin films by contact resonance atomic force microscopy

Measurements of Residual Stresses in Al Film/silicon Nitride Substrate Microcantilever Beam Systems