Evaluation of Residual Stress Depth Profiling in 7075 Aluminum Alloy Plates

王秋成,柯映林,章巧芳
DOI: https://doi.org/10.3321/j.issn:1000-6893.2003.04.011
2003-01-01
Abstract:The ability to accurately evaluate residual stresses will lead to stronger, lighter, longer-lasting and cheaper components in aircraft industry. However, the common residual stress measurement methods (e.g. hole drilling method and X-ray diffraction method) are only useful to measure the surface or subsurface residual stresses. With this in mind, the current research is to introduce the crack compliance method to characterize interior residual stresses in rolled 7075 aluminum plates procured in T73, T7351, T7352 and T7353 temper designations. Experimental results reveal that this newly proposed method can be used to evaluate through-thickness residual stresses of 7075 aluminum plates. It further showed that measured subsurface stresses measured by the crack compliance method are more sensitive and accurate than those obtained by the incremental hole drilling method or X-ray diffraction method.
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