Abstract:Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. Recently Huang, Rosakis and co-workers [Huang, Y., Ngo, D., Rosakis, A.J., 2005. Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures. Acta Mech. Sin. 21, 362–370; Huang, Y., Rosakis A.J., 2005. Extension of Stoney’s Formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry. J. Mech. Phys. Solids 53, 2483–2500; Ngo, D., Huang, Y., Rosakis, A. J., Feng, X. 2006. Spatially non-uniform, isotropic misfit strain in thin films bonded on plate substrates: the relation between non-uniform film stresses and system curvatures. Thin Solid Films (in press)] established methods for film/substrate system subject to non-uniform misfit strain and temperature changes. The film stresses were found to depend non-locally on system curvatures (i.e., depend on the full-field curvatures). The existing methods, however, all assume uniform film thickness which is often violated in the thin film/substrate system. We extend these methods to arbitrarily non-uniform film thickness for the thin film/substrate system subject to non-uniform misfit strain. Remarkably the stress-curvature relation for uniform film thickness still holds if the film thickness is replaced by its local value at the point where the stress is evaluated. This result has been experimentally validated in Part II of this paper.

Extension of the Stoney formula for the incremental stress of thin films

Study on the Mechanism and Measurement of Stress of Tio2 and Sio2 Thin-Films

Modified Stoney formula for in-situ lithiation stress measurement in thin-film Si electrode

The effect of thin film/substrate radii on the Stoney formula for thin film/substrate subjected to nonuniform axisymmetric misfit strain and temperature

A Theoretical Analysis for Arbitrary Residual Stress of Thin Film/Substrate System WithNonnegligible Film Thickness

A METHOD FOR DEFINING INITIAL STRESS IN PROGRESSIVELY DEPOSITED FILM ON A SUBSTRATE

Modeling and Characterization of Residual Stress Distribution of Thin Film/Substrate Structure with Non-negligible Film Thickness from Morphology

Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. Part II: Experimental validation of the non-local stress/curvature relations

Measurement of residual stress in multilayered thin films by a full-field optical method

Error Analyses on Some Typically Approximate Solutions of Residual Stress Within A Thin Film on A Substrate

Finite Element Analysis of the Indentation Stress Characteristics of the Thin Film/Substrate Systems by Flat Cylindrical Indenters

An Estimation Method on Failure Stress of Micro Thickness Cu Film-Substrate Structure

Modified Stoney's Formulas for Small-Scaled Bilayer Systems

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Thin Film/substrate Systems Featuring Arbitrary Film Thickness and Misfit Strain Distributions. Part I: Analysis for Obtaining Film Stress from Non-Local Curvature Information

Overview and applicability of residual stress estimation of film–substrate structure

Calculation of Thermal Stress in Microstructure Fabricated by Multilayer Thin Films

A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films

THIN FILM STRESSES MEASUREMENT AT ELEVATED TEMPERATURES BY DIGITAL GRADIENT SENSING METHOD

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution