Abstract:Residual stress in multilayer coatings is a complex phenomenon influenced by layer number and thickness, layer and substrate materials, deposition technique, process parameters, and working pressure. It is crucial to realize these stresses because they have a significant impact on the performance and reliability of multilayer structures in their applications. The measurement of the residual stress on multilayer thin films locally and globally is crucial. This study employed ring-core milling residual stress measurement on the High-Power Impulse Magnetron Sputtering (HiPIMS) fabricated Tungsten/Copper (W/Cu) Chromium/Copper (Cr/Cu) multilayer thin films. The displacement transformation strain was analyzed using Focused Ion Beam (FIB) ring-core milling combined with Digital Image Correlation (DIC), and the strain stress transformation calibration coefficients were analyzed through Finite Element Method (FEM) to investigate the residual stress of the thin films layer by layer. The study results indicated that the hard thin films (W, Cr) were the main source of residual stress in the multilayer thin film structure, while the soft thin film (Cu) had a lower residual stress. Having Cu as the intermediate layer was found to be effective for controlling the residual stress of thin films. The hard thin films encapsulated by the soft thin films had smaller stress values than those with hard films on the surface. In addition, the study observes the stress gradient and distribution at different depths and locations on the sample to reveal process parameters to balance between the soft and hard thin films and could help to predict the location of the damage on the multilayer thin films caused by higher stress.

Residual Stress Measurement in Thin Films Using a Slitting Method with Geometric Phase Analysis under a Dual Beam (FIB/SEM) System

Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films

Measurement Of Residual Stress In Multilayered Thin Films By A Full-Field Optical Method

Fabrication of speckle patterns by focused ion beam deposition and its application to micro-scale residual stress measurement

A Micro-Scale Strain Rosette for Residual Stress Measurement by SEM Moiré Method

Residual Stress Assessment of Interconnects by Slot Milling with Fib and Geometric Phase Analysis

Study of techniques for measuring residual stress in micromachined films

A new method for high resolution curvature measurement applied to stress monitoring in thin films

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Measurement of Residual Stresses in Pulsed Laser Deposited Thin Films

Research Progress of Residual Stress Measurement Methods

Determination of Residual Stress Distribution Combining Slot Milling Method and Finite Element Approach

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

A Novel Residual Stress Test Structure for MEMs Thin Films

FIB-DIC ring-core measurement of the residual stress on HiPIMS W/Cu and Cr/Cu multilayer thin films

Measurement of the stress-strain behavior of freestanding ultra-thin films

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

Effects of film thickness and microstructures on residual stress