Abstract:Scanning electron microscopy (SEM) enables microstructure characterization at multi-scale, having potential to quantify strain distribution across multiple fields of view (FOVs) and exploring coordinated relationships among the deformations of multi-scale microstructures. Optimizing distribution of multi-scale speckles is crucial for achieving high precision and efficiency in digital image correlation (DIC) computations. In this work, a multi-scale strain measurement method is proposed for in-situ SEM mechanical experiments, which relies on an uncomplicated multi-scale speckle preparation method. Multi-scale speckle preparation can be achieved by the combination of spin-coating and magnetron sputtering. By using micro- and macro-speckle, multi-scale strain calculations can be achieved during the in-situ SEM mechanical loading. The InSn macro-speckle is composed of controllable-sized InSn nanoscale speckles, ensuring that the accuracy of DIC measurements in the microscopic regions are not compromised by the coverage of macro-speckles in the testing region. In regions covered exclusively by SiO2 nano-speckles, in-situ SEM mechanical loading allows for the acquisition of high-resolution DIC (HR-DIC) and electron backscatter diffraction (EBSD) data from the same region and under the same deformation state. Experiments are conducted to illustrate the functionality and utility of the multi-scale speckles. Such experimental analyses offer an opportunity to further explore multi-scale strain heterogeneity in some advanced structural materials and provide reliable experimental verification for material mechanics simulations.

Fabrication of speckle patterns by focused ion beam deposition and its application to micro-scale residual stress measurement

Fabrication Technique of Micro/nano-Scale Speckle Patterns with Focused Ion Beam

Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films

Fabrication Technique of Deformation Carriers (gratings and Speckle Patterns) with Fib for Microscale/Nanoscale Deformation Measurement

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

A Micro-Scale Strain Rosette for Residual Stress Measurement by SEM Moiré Method

Residual Stress Measurement in Thin Films Using a Slitting Method with Geometric Phase Analysis under a Dual Beam (FIB/SEM) System

Fabrication of Micro-Scale Speckle Pattern and Its Applications for Deformation Measurement

Depth-sensing Indentation Measurement and Finite Element Analysis of Residual Stress Field Near Fatigue Crack Tip

On the Micro-Residual Stress Measurement of Shot Peened Nickel-Based Alloy Material by using Slot-Milling Method

Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system

Focused-ion-beam stress introducing technology for micro/nano-fabrications

Focused Ion Beam Nano-Machined Structures for Strain Analysis by A Moiré Technique

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Fabrication of a DIC Sensor for In-Plane Deformation Measurement

Interfacial Residual Stress Analysis of Thermal Spray Coatings by Miniature Ring-Core Cutting Combined with DIC Method

A Feasible Surface Patterning Method for SEM-DIC: Achieving High-Resolution In Situ Mapping of Local Strain and Microstructure to Reveal the Effect of Slip Transfer on Shear Strain Near Grain Boundaries

Determination of Residual Stress Distribution Combining Slot Milling Method and Finite Element Approach

FIB-DIC Residual Stress Evaluation in Shot Peened VT6 Alloy Validated by X-ray Diffraction and Laser Speckle Interferometry

Residual Stress Assessment of Interconnects by Slot Milling with Fib and Geometric Phase Analysis

Investigation of Strain in Microstructures by a Novel Moire Method