Abstract:The miniaturization of integrated circuits has led to a shift in lead frame fabrication methods from physical stamping to chemical etching. However, this process is highly sensitive to residual stress. We investigated the gradient distribution of residual stress, microstructure, and macroscopic texture in electronic copper foils using a layer-by-layer peeling method, and proposed a novel strategy for evaluating residual stress levels. Our findings reveal that the rolling-induced residual stress exhibits a gradient distribution along the thickness direction. Specifically, from the surface to the central layer, the stress transitions gradually from tensile to compressive, with the stress type primarily influenced by metal flow during rolling. Additionally, we observed gradient variations in the S and Cube texture. Tensile stress favors the formation of Cube-texture, while compressive stress promotes S-texture development. Notably, Cube-texture can lead to strain localization during rolling, directly impacting the local residual stress levels and distribution. Furthermore, quantitative analysis of dislocation density using peak profile methods revealed a consistent trend between {111} plane dislocation density and lateral residual stress. Further investigation highlighted that dislocations and precipitates associated with {111} planes in face-centered cubic metals significantly influence residual stress, with their combined effects determining the overall stress magnitude in relation to texture, dislocations, and precipitates.

Residual Stress Assessment of Interconnects by Slot Milling with Fib and Geometric Phase Analysis

Determination of Residual Stress Distribution Combining Slot Milling Method and Finite Element Approach

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Study on Measurement Method of Interior Stress Distributions in Engineering Rolled-Plates

Residual Stress Measurement in Thin Films Using a Slitting Method with Geometric Phase Analysis under a Dual Beam (FIB/SEM) System

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Experimental study of residual stress distribution in interfacial micro-region of SiC f /Ti17 composites via micro-slotting method

Evaluation of the Effect of Stress Relief Slots on QFN Strip Warpage Using Finite Element Analysis

Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip

A Micro-Scale Strain Rosette for Residual Stress Measurement by SEM Moiré Method

Residual thermo-creep deformation of copper interconnects by phase-shifting SEM Moiré method

Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

Experimental Study of Residual Stress Distribution in Interfacial Micro-Region of Sicf/Ti17 Composites Via Micro-Slotting Method

Study on Grain Structures and Residual Stresses of AI and Cu Interconnects

Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system

Fabrication of speckle patterns by focused ion beam deposition and its application to micro-scale residual stress measurement

Stress analysis of interconnect structure in COF by finite element method

Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films

Microstructure and Residual Stress Gradient Evolution Mechanism of Electronic Copper Strip for Lead Frame

Experimental and Numerical Studies of Stress Migration in Cu Interconnects Embedded in Different Dielectrics

Focused Ion Beam Nano-Machined Structures for Strain Analysis by A Moiré Technique