Abstract:The precise extraction of a thin slice (lamellae) from nano electronic devices using a focused ion beam (FIB) is crucial for transmission electron microscopy analysis, but it remains a challenge for 100 nm and beyond scale device components. In this study, we introduce a new method that utilizes the device's own features as markers during FIB thinning process by continuously monitoring the intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This allows for the targeted extraction of the desired device component with high precision. We successfully demonstrate the effectiveness of this approach by extracting lamellae from 100 nm length channel in arrayed carbon nanotube film field-effect transistors using FIB lift-out. Lay Description: In today's semiconductor industry, nanoscale and even atomic-scale investigation of the processing and product quality of nanodevices is essential, for which the combination of focused ion beam (FIB) and transmission electron microscope (TEM) is a commonly used tool. A key requirement is to ensure the TEM examined device components are precisely defined during the FIB process, which is becoming a challenge particularly for 100 nm scale (and beyond) nanodevices. In this study, the authors propose and further demonstrate a self-marked method that enables the feasibility of extracting sub-100 nm components of nanodevices (using the state-of-the art carbon nanotube transistor as a demo) using FIB, by continuously monitoring intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This article is protected by copyright. All rights reserved.

Fabrication Technique of Deformation Carriers (gratings and Speckle Patterns) with Fib for Microscale/Nanoscale Deformation Measurement

Fabrication of Micro-Scale Speckle Pattern and Its Applications for Deformation Measurement

Fabrication Technique of Micro/nano-Scale Speckle Patterns with Focused Ion Beam

Measurement of full-field large deformations at micro-scale

Micro-deformation measurement using focused ion beam moiré method

Deformation analysis in microstructures and micro-devices

Methodology for microscale deformation measurement of free-standing thin films

High-Frequency Deformation Grating Fabrication Techniques and Applications

Large-deformation analysis in microscopic area using micro-moiré methods with a focused ion beam milling grating

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

Fabrication of speckle patterns by focused ion beam deposition and its application to micro-scale residual stress measurement

Self-marked preparation of site-specific transmission electron microscope lamellae of nanodevices using focusing ion beam technique.

A Novel Method to Fabricate Micro-Gratings Applied for Deformation Measurement Around A Crack in A Thin Film

Fabrication of high-frequency moiré gratings for microscopic deformation measurement using focused ion beam milling

New Methods of Fabricating Gratings for Deformation Measurements: A Review

Fabrication of Micro-Moiré Gratings on a Strain Sensor Structure for Deformation Analysis with Micro-Moiré Technique

Micro/Nano Grating and Its Application to Moire Measurement

Deformation Measurement of A Small Component and A Thin Film Using Time Sequence Speckle Pattern Interferometry

The Technique for Fabricating Submicron Moiré Grating Using FIB Milling

Focused Ion Beam Moiré Method

Nano-Grating Fabrication Technique