Abstract:The precise extraction of a thin slice (lamellae) from nano electronic devices using a focused ion beam (FIB) is crucial for transmission electron microscopy analysis, but it remains a challenge for 100 nm and beyond scale device components. In this study, we introduce a new method that utilizes the device's own features as markers during FIB thinning process by continuously monitoring the intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This allows for the targeted extraction of the desired device component with high precision. We successfully demonstrate the effectiveness of this approach by extracting lamellae from 100 nm length channel in arrayed carbon nanotube film field-effect transistors using FIB lift-out. Lay Description: In today's semiconductor industry, nanoscale and even atomic-scale investigation of the processing and product quality of nanodevices is essential, for which the combination of focused ion beam (FIB) and transmission electron microscope (TEM) is a commonly used tool. A key requirement is to ensure the TEM examined device components are precisely defined during the FIB process, which is becoming a challenge particularly for 100 nm scale (and beyond) nanodevices. In this study, the authors propose and further demonstrate a self-marked method that enables the feasibility of extracting sub-100 nm components of nanodevices (using the state-of-the art carbon nanotube transistor as a demo) using FIB, by continuously monitoring intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This article is protected by copyright. All rights reserved.

Focused Ion Beam Moiré Method

Micro-deformation measurement using focused ion beam moiré method

Phase Shifting Focused Ion Beam Moiré Method

Focused Ion Beam Nano-Machined Structures for Strain Analysis by A Moiré Technique

Investigation of Strain in Microstructures by a Novel Moire Method

Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system

Fabrication of high-frequency moiré gratings for microscopic deformation measurement using focused ion beam milling

FIB Moiré Gratings and Their Application in the Measurement of Optical Fibers' Mechanical Properties

Large-deformation analysis in microscopic area using micro-moiré methods with a focused ion beam milling grating

Micro-moiré methods with high resolution microscopes and their applications

Self-marked preparation of site-specific transmission electron microscope lamellae of nanodevices using focusing ion beam technique.

Measurement of full-field large deformations at micro-scale

In-plane deformation measurement using the atomic force microscope moiré method

Afm Scanning Moire Method For Nano-Deformation Measurement

Fabrication Technique of Deformation Carriers (gratings and Speckle Patterns) with Fib for Microscale/Nanoscale Deformation Measurement

Experimental study on nanometer moire method

The Technique for Fabricating Submicron Moiré Grating Using FIB Milling

Fabrication Technique of Micro/nano-Scale Speckle Patterns with Focused Ion Beam

High Resolution AFM Scanning Moiré Method and Its Application to the Micro-Deformation in the BGA Electronic Package

Focused-ion-beam stress introducing technology for micro/nano-fabrications