Thermal Deformation Measurement of Electronic Package Using Advanced Moire Methods
HM Xie,GB Chai,A Asundi,Y Jin,YG Lu,BKA Ngoi,ZW Zhong
DOI: https://doi.org/10.1109/eptc.2000.906367
2000-01-01
Abstract:In this paper, laser moire interferometry method, electron beam moire method, atomic force microscope (AFM) scanning moire method, as well as scanning electronic microscope (SEM) scanning moire method are used to measure the thermal deformation of electronic packages. The measurement principle and the adaptability of these methods are discussed and compared. 1200 lines/mm holographic gratings in ultra low expansion (ULE) mold plate were replicated onto the cross section of the measured sections in a ball grid array (BGA) electronic package and a quad flat package (QFP). These holographic gratings were fabricated on ULE mold plates and were replicated onto measured area at 100 degreesC and 150 degreesC, respectively. The deformation measurement principle and experimental techniques using these moire methods are described. As application, the deformation in the different solder joints in the EGA electronic package and in the area near the die corner of the QFP electronic package was measured using these methods. Some useful results were obtained.