Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components
Dibakor Boruah,Nele Dewagtere,Bilal Ahmad,Rafael Nunes,Jeroen Tacq,Xiang Zhang,Hua Guo,Wim Verlinde,Wim De Waele
DOI: https://doi.org/10.3390/ma16041702
IF: 3.4
2023-02-18
Materials
Abstract:This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc-additive-manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering