Vertically Stacked Silicon Nanowire Transistors Fabricated by Inductive Plasma Etching and Stress-Limited Oxidation

Ricky M. Y. Ng,Tao Wang,Feng Liu,Xuan Zuo,Jin He,Mansun Chan
DOI: https://doi.org/10.1109/LED.2009.2014975
2009-01-01
Abstract:A simple top-down method for realizing an array of vertically stacked nanowires is presented. The process utilizes the nonuniformity in inductively coupled plasma (ICP) etching to form a scallop pattern at the sidewall of a tall silicon ridge that is further trimmed to form stacked nanowires by stress-limited oxidation. The process has been demonstrated to be controllable and repeatable, starting with bulk silicon wafers. Vertically stacked gate-all-around MOSFETs have been fabricated, which show excellent performance with a nearly ideal subthreshold slope of 62 mV/dec, a low leakage current, and a high I on/I off ratio of ~ 108.
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