Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

An Experimental Study of Chemical Vapour Deposition of Tungsten on Ti/TiN Adhesion Bilayers: Mechanical Properties

Impact of Rapid Thermal Annealing of Ti/TiN Bilayers on Subsequent Chemical Vapor Deposition of Tungsten

Effect of High Temperature Annealing on the Microstructure and Thermal Shock Resistance of Tungsten Coatings Grown by Chemical Vapor Deposition

Influence of Surface Morphology and Microstructure on Performance of CVD Tungsten Coating under Fusion Transient Thermal Loads

Thermal Shock Performance of CVD Tungsten Coating at Elevated Temperatures

Electrical and Mechanical Characterization of Chemical Vapor Deposition of Tungsten on Sputter-Deposited TiN Layers

Influence of Hydrogen on Chemical-Vapor-Deposition of Tungsten on Sputter-Deposited Tin Layers

Influence Of Annealing Temperature On Film Morphology And Tribological Performance Of Tisin-Ag Coating

Residual Stresses And Debonding Of Diamond Films On Titanium Alloy Substrates

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Thermal and Oxidation Stability of Ti$_x$W$_{1-x}$ Diffusion Barriers Investigated by Soft and Hard X-ray Photoelectron Spectroscopy

Structural, mechanical and tribological properties of WCTiN coatings produced by HiPIMS

Thermal Effects Of Residual Macrostress And Microstrain In Plasma-Assisted Cvd Tin Films

Improving the Anticorrosion and Mechanical Behaviour of PACVD TiN

Characteristics Of Residual Stresses In Ti-N Films Coated By Plasma Enhanced Chemical Vapor Deposition

Coefficient of thermal expansion of nanostructured tungsten based coatings assessed by thermally induced substrate curvature method

Epitaxy of Tungsten on Polycrystalline Molybdenum Using Chemical Vapor Transport Deposition Technology

Evolution of Chemical, Structural, and Mechanical Properties of Titanium Nitride Films with Different Thicknesses Fabricated Using Pulsed DC Magnetron Sputtering

Microstructure of Chemical Vapor Transport Deposition Single Crystal Tungsten Coating Working at 1600°C

Coefficient of thermal expansion of nanostructured tungsten based coatings assessed by substrate curvature method

Microstructural Effects of Y2O3 and TiC Additions in Tungsten