Influence of Hydrogen on Chemical-Vapor-Deposition of Tungsten on Sputter-Deposited Tin Layers

SL ZHANG,R PALMANS,J KEINONEN,CS PETERSSON,K MAEX
DOI: https://doi.org/10.1063/1.114931
IF: 4
1995-01-01
Applied Physics Letters
Abstract:Tungsten (W) films are deposited on sputter-deposited TiN adhesion layers in a cold-wall chemical vapor deposition reactor, initiated with the deposition of a W nucleation layer by SiH4 reduction of WF6. H2 is also introduced in the reactor for some depositions. The electrical resistivity and mechanical stress of the W films are found to be dependent on the underlying TiN layers as well as on the presence of H2 during W nucleation layer deposition. A higher resistivity is obtained when the W is deposited on the TiN prepared at 250 °C than on the TiN prepared at 450 °C. For the W deposited on the low-temperature TiN, the resistivity is reduced by adding H2 to the reactants during W nucleation layer deposition; while for the W deposited on the high-temperature TiN, the resistivity is almost insensitive to the H2 addition. More oxygen and fluorine are found at the W–TiN interface for the W deposited on the low-temperature TiN than on the high-temperature TiN. Introduction of H2 to the reactants during W nucleation layer deposition reduces the concentrations of interfacial fluorine and oxygen, in agreement with thermodynamic predictions. A lower film stress is obtained for the W deposited on the high-temperature TiN layers and/or with H2 addition. The W films become less textured when H2 is introduced to the reactants during W nucleation layer deposition.
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