Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Effect of High Temperature Annealing on the Microstructure and Thermal Shock Resistance of Tungsten Coatings Grown by Chemical Vapor Deposition

Thermal Shock Performance of CVD Tungsten Coating at Elevated Temperatures

Influence of Surface Morphology and Microstructure on Performance of CVD Tungsten Coating under Fusion Transient Thermal Loads

Enhancing High-Temperature Wear Resistance by Constructing the Amorphous-Crystal Heterointerface Structure in WO3/TiO2 Composite Coatings

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Surface Modification of W–V Alloy Exposed to High Heat Flux Helium Neutral Beams

Preparation and Properties of Textured Ni–W Coatings Electrodeposited on the Steel Surface from a Pyrophosphate Bath

Surface Cracking of Tungsten-Vanadium Alloys under Transient Heat Loads

Microstructure of Chemical Vapor Transport Deposition Single Crystal Tungsten Coating Working at 1600°C

The Effect of Annealing on Microstructure and High Temperature Erosion Property of Arc-Spraying Coatings Containing Nanosized Ceramic Powders

Evolution of microstructure and texture of moderately warm-rolled pure tungsten during annealing at 1300 °C

Influence Of Annealing Temperature On Film Morphology And Tribological Performance Of Tisin-Ag Coating

Effect of annealing on the microstructure behavior of D+-irradiated W-2vol.%TiC composite prepared by wet-chemical method

Effect of heat treatment on the structural properties of tungsten carbide coatings deposited by RF magnetron sputtering

High-temperature tensile and thermal shock characterization of low-temperature rolled tungsten

Effect of Tungsten on Microstructures of Annealed Electrodeposited Ni-W Alloy and Its Corrosion Resistance

Hardness Loss and Microstructure Evolution of 90% Hot-Rolled Pure Tungsten at 1200–1350 °C

Thermal Performance and Microstructure of Vacuum Plasma Sprayed Tungsten Coatings under Cyclic Heat Load

Effects of annealing temperature on the microstructure, mechanical and tribological properties of CrAlTiN coatings

Evolution of microstructure and texture in a warm-rolled yttria dispersion-strengthened tungsten plate during annealing in the temperature range between 1200 °C and 1350 °C

An Experimental Study of Chemical Vapour Deposition of Tungsten on Ti/TiN Adhesion Bilayers: Mechanical Properties