Characterization of Radiation Damage Induced by B and B4 Ion Implantation into Silicon

J. H. Liang,Y. Z. Chen,C. M. Lin
DOI: https://doi.org/10.1016/j.nimb.2011.04.091
IF: 1.279
2011-01-01
Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms
Abstract:In this study, B1- monomer and B4- cluster ions of the same boron kinetic energy level per atom (20keV/atom) and total atomic fluence (2×1015atoms/cm2) were implanted into silicon wafers held at liquid nitrogen temperature (LT, −196°C), and followed by a two-step furnace annealing together with rapid thermal annealing treatment. The characteristics of radiation damage in both the as-implanted and as-annealed specimens were probed using Raman scattering spectroscopy (RSS) as well as transmission electron microscopy (TEM). Both the RSS and TEM results revealed that heavily-damaged and amorphous structures are formed in the as-implanted B1 and B4 specimens, respectively, mainly due to the so-called non-linear damage effect existed in the latter. Furthermore, there is less radiation damage remained in the as-annealed B4 specimens when compared to the as-annealed B1 ones, resulting from the occurrence of solid phase epitaxial growth (SPEG) in the amorphous layer of the former which thus causes significant removal of radiation damage.
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