Properties of Cu Film and Ti/Cu Film on Polyimide Prepared by Ion Beam Techniques

Jie Ran,Jizhong Zhang,Wenqing Yao,Yueteng Wei
DOI: https://doi.org/10.1016/j.apsusc.2010.05.016
IF: 6.7
2010-01-01
Applied Surface Science
Abstract:Cu film and Ti/Cu film on polyimide substrate were prepared by ion implantation and ion beam assisted deposition (IBAD) techniques. Three-dimension white-light interfering profilometer was used to measure thickness of each film. The thickness of the Cu film and Ti/Cu film ranged between 490nm and 640nm. The depth profile, surface morphology, roughness, adhesion, nanohardness, and modulus of the Cu and Ti/Cu films were measured by scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), and nanoindenter, respectively. The polyimide substrates irradiated with argon ions were analyzed by scanning electron microscopy (SEM) and AFM. The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polyimide.
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