Abstract:In this paper, Cu thin films were deposited on Si (100) substrates by the high-power impulse magnetron sputtering (HiIPMS) technique, and the effects of different duty cycles (from 2.25% to 5.25%) on the plasma discharge characteristics, microstructure, and electrical properties of Cu thin films were investigated. The results of the target current test show that the peak target current remains stable under 2.25% and 3% duty cycle conditions. Under the conditions of a 4.5% and 5.25% duty cycle, the target peak current shows a decreasing trend. The average power of the target shows a rising trend with the increase in the duty cycle, while the peak power of the target shows a decreasing trend with the increase in the duty cycle. The results of OES show that with the increase in the duty cycle, the total peak intensity of copper and argon emissions shows an overall increasing trend. The duty cycle from 3% to 4.5% change in copper and argon emission peak total intensity change is not obvious. The deposition rate and surface morphology of the copper film were investigated by scanning electron microscopy, and the deposition rate of the copper film increased with the increase in the duty cycle, which was mainly due to the increase in the average power. The surface roughness of the copper film was evaluated by atomic force microscopy. X-ray diffraction (XRD) was used to analyze the grain size and texture of the Cu film, and the results showed that the average grain size of the Cu film increased from 38 nm to 59 nm on the (111) and (200) crystal planes. Four-probe square resistance test copper film resistivity in 2.25%, 3% low duty cycle conditions of the copper film resistivity is generally higher than 4.5%, 5.25% high duty cycle conditions, the copper film resistivity shows the trend of change is mainly affected by the copper film grain size and the (111) face of the double effect of the optimal orientation. The lowest resistivity of the copper film measured under the 4.5% duty cycle condition is 1.7005 μΩ·cm, which is close to the intrinsic resistivity of the copper film of 1.67 μΩ·cm.

Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system

Interlayer Design for Strong Adhesion in the Double-Layer Flexible Copper Clad Laminate Via Hipims Deposition

Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films

Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering

Diffusion and Adhesion Properties of Cu Films on Polyimide Substrates

Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film

Effects of HiPIMS Duty Cycle on Plasma Discharge and the Properties of Cu Film

Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification

Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Adhesion property between low-thermal- expansion poly (benzoxazole-imide) film and ion-implanted copper

Plasma Treatment and Surface Analysis of Polyimide Films for Electroless Copper Buildup Process

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma

Properties of Cu Film and Ti/Cu Film on Polyimide Prepared by Ion Beam Techniques

Studies of Polyimide/copper Interface and Its Improvement by a Two‐component Primer

Superiority of High Power Impulse Magnetron Sputtering in Niobium Films Deposition on Copper

Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition

Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Study of Indium Tin Oxide Films Deposited on Colorless Polyimide Film by Magnetron Sputtering