Abstract:Demand for high‐efficiency electromagnetic wave (EMW) absorption composite films continues to increase with technical advances in 5G telecommunications, wearable electronics, portable devices, and deployable military applications. However, realizing flexible ultra‐thin single‐layer EMW absorption composite films with multifunctionality, rather than using traditional particle absorbents, is a known challenge. In this study, the authors propose a series of polyimide (PI) reinforced composite films with periodic copper‐based electroconductive units that possess tunable electrical properties for specific applications. These periodic units optimize the electric field distribution of the films in an alternating electromagnetic field, resulting in stronger power loss. Furthermore, the hierarchical structure and abundant heterogeneous interfaces of each unit contribute to multiple scattering and polarization loss. The obtained copper mesh@Cu2−xS@PI (CCP) film shows excellent EM shielding performance (63.7 dB), while the Air@Cu2−xS@PI (ACP) film delivers a superior specific absorbency value of 391.43% mm–1 in the X‐band. Furthermore, owing to their mechanical properties, thermal conduction/dissipation performance, and excellent environmental stability characteristics, these films offer significant potential as high‐performance EMW response materials with resistance to harsh conditions. A series of polyimide reinforced composite films with periodic copper‐based electroconductive units are proposed for the first time, where these units are composed of a Cu2−xS layer and a hollow channel. The material leads to stronger power loss, polarization loss, and multiple scattering, offering a feasible strategy for the design of an electromagnetic wave absorption film.

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Interlayer Design for Strong Adhesion in the Double-Layer Flexible Copper Clad Laminate Via Hipims Deposition

Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film

Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using Cu2O Nanoparticles

Improvement in the Figure of Merit of ITO-Metal-ITO Sandwiched Films on Poly Substrate by High-Power Impulse Magnetron Sputtering

Reflective and conductive surface-silvered polyimide films prepared by surface graft copolymerization and electroless plating

Enhancing the bond strength of magnetron-sputtered copper layers on polyimide and polyether ether ketone surfaces through surface modification

Transparent and Corrosion-Resistant PDMS/ITO/Ag/ITO Multilayer Film for Efficient EMI Shielding in a Marine Environment

Adhesion-Enhanced Flexible Conductive Metal Patterns on Polyimide Substrate Through Direct Writing Catalysts with Novel Surface-Modification Electroless Deposition

Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition

Direct Surface In-Situ Activation for Electroless Deposition of Robust Conductive Copper Patterns on Polyimide Film

Optically Transparent Sulfur-Containing Polyimide−TiO2 Nanocomposite Films with High Refractive Index and Negative Pattern Formation from Poly(amic Acid)−tio2 Nanocomposite Film

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

A Facile Method for Preparing Highly Conductive and Reflective Surface-Silvered Polyimide Films

A Flexible, Mechanically Strong, and Anti‐Corrosion Electromagnetic Wave Absorption Composite Film with Periodic Electroconductive Patterns