Abstract:Benefiting from the unique structure, the copper-tungsten (Cu-W) multilayered film is attractive due to its high strength and fracture toughness, diffusion barrier effects and radiation tolerance. However, the influence of period on the interfacial stability and strengthening mechanism during annealing has seldom been touched. Hence, the Cu-W multilayers with the periods from 1.6 to 27 nm were synthesized by altering substrate rotation speed using co-sputtering. In contrast to the findings in literature by sequential sputtering, kinetically constrained deposited atoms contribute to the more amorphous phase near interface in the films with smaller periods and result in the reduced hardness. During annealing, Cu and W atoms are thermal-activated and up-hill diffuse towards Cu- and W-rich layers, respectively, which can not only eliminate the amorphous phases but also enlarge the concentration ratio and result in the spinodal decomposition. In turn, the films with larger periods present higher thermal resistibility against phase separation due to the stronger diffusion barrier effect of thicker W-rich layers. The mechanical properties of the annealed films generally increase with the temperature up to 400 degrees C due to the reduced amorphous phases and the enhanced interfacial strengthening. At 500 degrees C, the separation of soft Cu phase and the loss of coherency mainly lead to the reduced mechanical properties. It is striking that the Cu-W film with the moderate thickness exhibits the highest hardness at higher temperature of 500 degrees C, indicating the significant importance of period to control their high temperature mechanical properties.

Influence of period deviation on soft x-ray diffraction of multilayers

Effect Of Thickness Ratio Deviation On Soft-X-Ray Diffraction Of Multilayers

X-ray Diffraction of Multilayers with a Systematic Deviation of Period

Observation of Systematic Deviations of Period in W/Si and W/C Multilayers

THE EFFECT OF ANNEALING ON THE X-RAY DIFFRACTION OF W/C PERIODIC MULTILAYERS

Effects of Periods on the Evolution of Microstructure and Mechanical Properties of Multilayered Cu-W Films During Thermal Annealing

Investigation of Ultra-Short-period W/C Multilayers for Soft X-ray Optics

Study On Quasi-Periodic Ta/Al Multilayer Films By X-Ray-Diffraction

Influence of Modulation Period on Mechanical Property of Nanoscale TaN/NbN Multilayered Coatings

Precise Calculation of the Periodic-thickness for Multilayer

Simulation of X-ray diffraction of multilayers with Cantor sequences

SMALL-ANGLE X-RAY DIFFRACTION STUDY OF AMORPHOUS MULTILAYER AND SINGLE LAYER THIN FILMS

Asymmetric Interface and Growth Mechanism in Sputtered W/Si and WSi2/Si Multilayers

Simultaneous Determination of Tensile and Shear Strains of Crystalline Bilayers Using Three Bragg Reflections of X-rays

Observations of an unusual modulated structure with double-periodicity in Fe–Al multilayers

Structural Studies Of Mo/Si Multilayers By Exafs

X-ray Diffraction Studies of Trilayer Oscillations in the Preferred Thickness of in Films on Si(111)

XAFS Study on the Microstructure of Mo/Si Multilayers

Microstructure Evolution in Magnetron-Sputtered WC/SiC Multilayers with Varied WC Layer Thicknesses

Study of Small Angle X-ray-diffraction Theory of Multilayer for Water Window Reign X-ray

Periodic Structure and Quantum Size Effect of μc-Si∶H/a-Si∶H Multilayers