A New Method Used to Control the Structure of High Rate Microcrystalline Silicon Thin Films

X. D. Zhang,H. Zhang,Q. Yue,C. C. Wei,J. Sun,G. F. Hou,S. Z. Xiong,X. H. Geng,Y. Zhao
DOI: https://doi.org/10.1002/pssc.200982765
2010-01-01
Abstract:We report a systematic study of plasma heating effect on microcrystalline silicon (μc-Si:H) deposition. Normally, substrate surface temperature increases with time during a high rate deposition of μc-Si:H thin film, especially under a high power and high pressure condition. We deposited μc-Si:H films using a very high frequency discharge under the high pressure and high power condition at a fixed heater temperature or a profiled heater temperature. Raman spectra with different wavelength excitations showed that a proper heater temperature profiling during μc-Si:H deposition is an effective method to modify the structure of μc-Si:H films, which can control the structure evolution to form a uniform crystallinity along the growth direction and reduce the amorphous incubation layer thickness (© 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)
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