Microstructure Characterization of Microcrystalline Silicon Thin Films Deposited by Very High Frequency Plasma-Enhanced Chemical Vapor Deposition by Spectroscopic Ellipsometry

He Zhang,Xiaodan Zhang,Changchun Wei,Jian Sun,Xinhua Geng,Shaozhen Xiong,Ying Zhao
DOI: https://doi.org/10.1016/j.tsf.2011.04.166
IF: 2.1
2011-01-01
Thin Solid Films
Abstract:We applied ex situ spectroscopic ellipsometry (SE) on silicon thin films across the a-Si:H/μc-Si:H transition deposited using different hydrogen dilutions at a high pressure by very high frequency plasma enhanced chemical vapor deposition (VHF-PECVD). The optical models were based on effective medium approximation (EMA) and effective to estimate the thickness of the amorphous incubation layer and the volume fractions of amorphous, microcrystalline phase and void in μc-Si:H thin films. We obtained an acceptable data fit and the SE results were consistent with that from Raman spectroscopy and atomic force microscopy (AFM). We found a thick incubation layer in μc-Si:H thin films deposited at a high rate of ~5Å/s and this microstructure strongly affected their conductivity.
What problem does this paper attempt to address?