THE OES IN DEPOSITING MICROCRYSTALLINE SILICON MATERIAL BY RF-PECVD

Feng Zhu,Ying Zhao,Changchun Wei,Jian Sun,Yan Wang,Hong Song,Xinhua Geng
DOI: https://doi.org/10.3321/j.issn:0254-0096.2005.05.005
2005-01-01
Abstract:The microcrystalline silicon thin film materials were deposited by RF-PECVD technology at high plasma power and low substrate temperature. Measuring the optical emission spectroscopy (OES) could analyze the resultants in plasma. From OES' analysis, the effect of resultants in plasma on growth of microcrystalline silicon was known. The intensity of SiH*, H β*, H α* and H 2* in plasma increase slowly with silane concentration increasing, whereas the ration of H α*/SiH* monotonously is decreased H a* increases quickly, SiH*, H β* and H 2* being saturation, and H α*/SiH* monotonously increases with plasma power increasing. The brightness of plasma mainly depended on the intensity of SiH*, H β* and H 2* in plasma.
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