Abstract:Here, the key mechanisms and diverse applications of controlled voltage‐assisted chemical etching (ECE) and metal‐assisted chemical etching (MaCE) of silicon, spanning both micro and nanoscale dimensions, are reviewed. This review offers a distinctive understanding of ECE and MaCE technologies, highlighting the most recent achievements, and discussing their future perspectives in silicon micro and nano machining. Sculpting silicon at the micro and nano scales has been game‐changing to mold bulk silicon properties and expand, in turn, applications of silicon beyond electronics, namely, in photonics, sensing, medicine, and mechanics, to cite a few. Voltage‐ and metal‐assisted chemical etching (ECE and MaCE, respectively) of silicon in acidic electrolytes have emerged over other micro and nanostructuring technologies thanks to their unique etching features. ECE and MaCE have enabled the fabrication of novel structures and devices not achievable otherwise, complementing those feasible with the deep reactive ion etching (DRIE) technology, the gold standard in silicon machining. Here, a comprehensive review of ECE and MaCE for silicon micro and nano machining is provided. The chemistry and physics ruling the dissolution of silicon are dissected and similarities and differences between ECE and MaCE are discussed showing that they are the two sides of the same coin. The processes governing the anisotropic etching of designed silicon micro and nanostructures are analyzed, and the modulation of etching profile over depth is discussed. The preparation of micro‐ and nanostructures with tailored optical, mechanical, and thermo(electrical) properties is then addressed, and their applications in photonics, (bio)sensing, (nano)medicine, and micromechanical systems are surveyed. Eventually, ECE and MaCE are benchmarked against DRIE, and future perspectives are highlighted.

Study of Excimer Laser Electrochemical Etching Silicon

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Laser micro/nano machining of silicon

Excimer-laser-induced micropatterning of silicon dioxide on silicon substrates

Stress-Etching Using Laser Electrochemical Micromachining with Masks

Sub-damage-threshold plasma etching and profile tailoring of Si through laser-stimulated thermal desorption

Investigation on Laser Etch-Machining Underwater Based on Thermal-Mechanical Effect

Modeling of excimer laser ablation of silicon carbide

Efficiency of silicon micromachining by femtosecond laser pulses in ambient air

Large-area femtosecond laser milling of silicon employing trench analysis

Chemical Etching Processes at the Dynamic GaAs/Electrolyte Interface in the Electrochemical Direct-Writing Micromachining

A process study of electron beam nano-lithography and deep etching with an ICP system

Liquid-Assisted Femtosecond Laser Precision-Machining of Silica.

One-Step femtosecond laser irradiation of Single-Crystal Silicon: Evolution of Micro-Nano structures and damage investigation

Development of a Selective Wet-Chemical Etchant for 3D Structuring of Silicon via Nonlinear Laser Lithography

Serum gamma-glutamyltransferase as a measure of sporidesmin-induced liver damage in sheep.

High Anodic-Voltage Focusing of Charge Carriers in Silicon Enables the Etching of Regularly-Arranged Submicrometer Pores at High Density and High Aspect-Ratio

Numerical Investigation of the Kinetics of Non-Equilibrium Phase Transitions in Silicon Induced by an Ultra-Short Laser Pulse

Voltage‐ and Metal‐assisted Chemical Etching of Micro and Nano Structures in Silicon: A Comprehensive Review

Study of the Nanometer Scale Polysilicon Micro Structure Etching

Study of high aspect ratio etching in silicon by a mixture of SF6/O2 using a 2-D model based on a Monte Carlo approach.