Abstract:Although ultrafast laser materials processing has advanced at a breakneck pace over the last two decades, most applications have been developed with laser pulses at near-IR or visible wavelengths. Recent progress in mid-infrared (MIR) femtosecond laser source development may create novel capabilities for material processing. This is because, at high intensities required for such processing, wavelength tuning to longer wavelengths opens the pathway to a special regime of laser-solid interactions. Under these conditions, due to the ${\lambda}^2$ scaling, the ponderomotive energy of laser-driven electrons may significantly exceed photon energy, band gap and electron affinity and can dominantly drive absorption, resulting in a paradigm shift in the traditional concepts of ultrafast laser-solid interactions. Irreversible high-intensity ultrafast MIR laser-solid interactions are of primary interest in this connection, but they have not been systematically studied so far. To address this fundamental gap, we performed a detailed experimental investigation of high-intensity ultrafast modifications of silicon by single femtosecond MIR pulses (${\lambda}$ = 2.7 - 4.2 ${\mu}$m). Ultrafast melting, interaction with silicon-oxide surface layer, and ablation of the oxide and crystal surfaces were ex-situ characterized by scanning electron, atomic-force, and transmission electron microscopy combined with focused ion-beam milling, electron diffractometry, and ${\mu}$-Raman spectroscopy. Laser induced damage and ablation (LIDA) thresholds were measured as functions of laser wavelength. The traditional theoretical models did not reproduce the wavelength scaling of the damage thresholds. To address the disagreement, we discuss possible novel pathways of energy deposition driven by the ponderomotive energy and field effects characteristic of the MIR wavelength regime.

Efficiency of silicon micromachining by femtosecond laser pulses in ambient air

Effects of Parameters in Femtosecond Laser Micromachining on Ablation of Silicon

Thermal and non-thermal ablation mechanisms in crystalline silicon by femtosecond laser pulses: classical approach of the carrier density two temperature model

Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

Influence of liquid environments on femtosecond laser ablation of silicon

Combined Continuum-Atomistic Modeling of Ultrashort-Pulsed Laser Irradiation of Silicon

Single-crystal silicon ablation with temporally delayed femtosecond laser double-pulse trains

The Experimental and Modeling Study of Femtosecond Laser-Ablated Silicon Surface

Effects of dopant type and concentration on the femtosecond laser ablation threshold and incubation behaviour of silicon

Experimental Study on 800 Nm Femtosecond Laser Ablation of Fused Silica in Air and Vacuum

Large-area femtosecond laser milling of silicon employing trench analysis

Single-Shot Multi-Stage Damage and Ablation of Silicon by Femtosecond Mid-infrared Laser Pulses

Ablation Threshold and Material Removal Mechanisms of SiC Processed by Femtosecond Laser

Hydrodynamic Simulation of Silicon Ablation by Ultrashort Laser Irradiation

The influence of ultrafast temporal energy regulation on the morphology of Si surfaces through femtosecond double pulse laser irradiation

Nanosecond pulsed laser ablation of silicon—finite element simulation and experimental validation

Modifying single-crystal silicon and trimming silicon microring devices by femtosecond laser irradiation

Femtosecond pulsed laser-induced ablation region development on the Surface of silicon

Remote and Rapid Micromachining of Broadband Low-Reflectivity Black Silicon Surfaces by Femtosecond Laser Filaments.

Femtosecond Laser Precision Engineering: From Micron, Submicron, to Nanoscale

Femtosecond-pulsed laser micromachining of a 4H–SiC wafer for MEMS pressure sensor diaphragms and via holes