Dual-wavelength femtosecond laser-induced low-fluence single-shot damage and ablation of silicon

Alexander V. Bulgakov,Juraj Sládek,Jan Hrabovský,Inam Mirza,Wladimir Marine,Nadezhda M. Bulgakova
DOI: https://doi.org/10.1117/12.3012585
2024-02-25
Abstract:A study of damage and ablation of silicon induced by two individual femtosecond laser pulses of different wavelengths, 1030 and 515 nm, is performed to address the physical mechanisms of dual-wavelength ablation and reveal possibilities for increasing the ablation efficiency. The produced ablation craters and damaged areas are analyzed as a function of time separation between the pulses and are compared with monochromatic pulses of the same total energy. Particular attention is given to low-fluence irradiation regimes when the energy densities in each pulse are below the ablation threshold and thus no shielding of the subsequent pulse by the ablation products occurs. The sequence order of pulses is demonstrated to be essential in bi-color ablation with higher material removal rates when a shorter-wavelength pulse arrives first at the surface. At long delays of 30-100 ps, the dual-wavelength ablation is found to be particularly strong with the formation of deep smooth craters. This is explained by the expansion of a hot liquid layer produced by the first pulse with a drastic decrease in the surface reflectivity at this timescale. The results provide insight into the processes of dual-wavelength laser ablation offering a better control of the energy deposition into material.
Optics,Materials Science
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to study the damage and ablation mechanisms of silicon induced by dual - wavelength lasers and explore the possibility of improving the ablation efficiency through single - exposure of silicon to femtosecond laser pulses of two different wavelengths (1030 nm and 515 nm) at a low energy density (below the single - pulse ablation threshold). Specifically, the paper focuses on: 1. **Physical mechanisms of dual - wavelength laser ablation**: To study how laser pulses of different wavelengths, when temporally separated, affect the ablation process of silicon. 2. **Improvement of ablation efficiency**: To explore whether dual - wavelength lasers can significantly increase the material removal rate under specific time - delay conditions, especially at a low energy density. 3. **Effect of pulse sequence**: To analyze the effect of the order in which laser pulses of different wavelengths reach the surface on the ablation effect, especially when the short - wavelength pulse arrives first. 4. **Optimization of ablation pit morphology**: To study whether dual - wavelength lasers can produce smoother and deeper ablation pits, thereby improving the quality of laser processing. Through experiments and theoretical simulations, the paper reveals the advantages of dual - wavelength lasers under specific conditions, especially the efficient ablation mechanism when the short - wavelength pulse arrives first at a long delay time (30 - 100 ps). These findings provide new ideas for optimizing laser processing techniques.