Abstract:W-Cu is extensively utilized as an exceptional heat sink material in high-power electronic devices. During the electronic packaging process, the surface of W-Cu demands plating with Ni or Au layers to protect the substrate and improve solderability. To enhance the bonding strength between the Ni-P coating and the W-Cu substrate, this work focused on exploring the pretreatment process for electroless nickel plating on W-Cu, with the goal of achieving a highly adhesive Ni-P coating. The effect of heat treatment on the Ni-P coating and the wetting of AgCu solder on the coating was investigated, and the growth mechanism of the Ni-P coating on the W-Cu surface was summarized. Utilizing a pretreatment process that incorporated sandblasting, hot acid pickling, and strike nickel plating. A uniform and dense strike nickel layer was obtained when pre-plated for 6 min at a current density of 3.6 A/dm2. Subsequently, the surface cells of the Ni-P coating attained through electroless plating were tightly bonded and fine, possessing optimal crystallinity. The Ni-P coating demonstrated outstanding bonding strength with the substrate, measuring 75.8 N, which increased to 83.7 N after a two-hour heat treatment at 200 degrees C. In the wettability experiment of the Ni-P coating, a reduction in surface roughness facilitated the solder wetting while coating crystallization hindered wetting. After undergoing 80 thermal shock cycles, no spalling or bubbling occurred on the surface of the as-plated and heat-treated Ni-P coating, indicating that the fabricated coating exhibited superb adhesion. This study addressed the lack of research on the pretreatment process of electroless nickel plating on the W-Cu surface, serving as a reference for electroless nickel plating on W-Cu.

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