Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte

Xiaofei Zhan,Jian Lian,Hongjun Li,Xiubin Wang,Jiaan Zhou,Khuong Trieu,Xinping Zhang
DOI: https://doi.org/10.1016/j.electacta.2020.137391
IF: 6.6
2021-01-01
Electrochimica Acta
Abstract:A simple and novel strategy for fabricating highly (111) textured nanotwinned copper (nt-Cu) by using medium-frequency (10-1000 Hz) pulsed electrodeposition in an ultra-low Cu2+ concentration electrolyte without additives is reported. First, direct-current electrodeposition was conducted to determine the appropriate Cu(2+)concentration, which is critical for subsequent pulsed electrodeposition. Highly (111) textured Cu with densely packed coherent nanotwins was successfully prepared by varying the pulse frequency. The mechanical properties and thermal stability of the as-deposited Cu were also studied. The twin thickness was found to decrease with an increase in the pulse frequency. The spiral feature of the hexagonal pyramid on the top of the nt-Cu indicated that the formation of periodic twin structures could be the result of the screw dislocation-induced growth. The as-prepared nt-Cu showed the same thermal stability and mechanical properties as those prepared using existing preparation methods. The outcomes of this work deepen the understanding of the formation of nanotwin structures in copper electrodeposits and broaden the application of this process in the industry. (c) 2020 Elsevier Ltd. All rights reserved.
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