Abstract:The hot dip silicon-plating method is considered as a promising surface coating technology. However, the correlation between the process parameters and the WSi2 coatings properties is unclear entirely. In this work, the SEM, TEM, AFM combining with EBSD methodology are applied to study the evolution behavior of surface and interface morphologies, roughness and texture of tungsten disilicide coatings. The coating mainly consists of WSi2 outer layer and W5Si3 interface layer, HDS coating presents a smooth surface and dense interface. AFM results show that the particle distribution on the coating surface is homogeneous with a small surface roughness (Ra = 124.57–422.67 nm). It is observed that at low deposition times, the surface morphologies are more homogeneous with lower surface roughness and vice versa. EBSD results show that the orientation of the columnar WSi2 grains in the coating is perpendicular to the W substrate, the grain diameter of WSi2 range from 7.45 to 10.67 μm, and has a significant preference orientation on (100) and (110) crystal planes. This is mainly attributable to the vigorous bombardment from the high energy Si ions prevents the formation of the lowest energy (111) crystal plane orientation.

Surface morphology and crystal orientation of electrodeposited tungsten coatings with different pulse parameters

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Effect of the Pulse Duty Cycle on the Microstructure and Properties of a Jet Electrodeposited Nanocrystalline Copper Coating

Preparation and Properties of Textured Ni–W Coatings Electrodeposited on the Steel Surface from a Pyrophosphate Bath

Evolution of surface morphology, roughness and texture of tungsten disilicide coatings on tungsten substrate

Study of Thick Tungsten Coatings Deposited on Various Molybdenum and Copper Substrates

Structure and corrosion property of pulse electrodeposited nanocrystalline nickel-tungsten-copper alloy coating

Effect of Laser Spot Overlap on the Mechanical Properties and Corrosion Resistance of Laser-Assisted Electrodeposited Ni-based Coatings

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings

Effects of Pulse Parameters on Macro-Particle Production in Pulsed Cathodic Vacuum Arc Deposition

Investigation on the effect of nickel and nickel-chromium alloy pulse current plating on copper substrate

Effects Of Wc Crystal Characteristics On Microstructure And Mechanical Property Of Hvof-Sprayed Wc-Cocr Coatings

INFLUENCE OF SURFACE ROUGHNESS OF SUBSTRATE ON THE PROPERTIES OF Ni–Co–Fe ELECTRODEPOSITION COATING ON COPPER

Strategies to Achieve High Strength and Ductility of Pulsed Electrodeposited Nanocrystalline Co-Cu by Tuning the Deposition Parameters

Characterization of Thick Tungsten Coating on Cu Alloy Substrate Prepared by Electrodeposition

Microstructure of Chemical Vapor Transport Deposition Single Crystal Tungsten Coating Working at 1600°C

Preparation and Investigation of Ni–Co–P Alloy Coatings Using Jet Electrodeposition with Varying Pulse Parameters

Influence of Cu Content on the Microstructure and Mechanical Properties of Cr-Cu-N Coatings

Thermal Performance and Microstructure of Vacuum Plasma Sprayed Tungsten Coatings under Cyclic Heat Load

Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte

Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils