Ultra-high flatness and conductivity of copper electrodeposits obtained by nano-twinned/fine-grained double layer electrodeposition

Zhijie Jiang,Peixin Chen,Tao Hang,Huiqin Ling,Ming Li
DOI: https://doi.org/10.1016/j.matlet.2024.137506
IF: 3
2024-10-18
Materials Letters
Abstract:Electrodeposited copper (Cu) is utilized as an electrical interconnect material in electronic devices. In high-frequency signal transmission, the skin effect of current conduction is becoming more pronounced, necessitating higher requirements for conductor's surface roughness and conductivity. In this study, we fabricate a double-layer copper (dl-Cu) consisting of highly flat fine-grained copper (fg-Cu) on top and perpendicular nano-twinned copper (pnt-Cu) at the bottom through two-step electrodeposition. The overall grain growth into large grains is achieved by annealing, and reverse dissolution before electrodeposition of fg-Cu is found to eliminate the interface of fg-Cu and pnt-Cu. The surface roughness of dl-Cu is only 4.65 nm, and the conductivity after annealing reaches 95.5 % of the international annealed copper standard.
materials science, multidisciplinary,physics, applied
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